Substrate Handling
Reliable and flexible transport solutions for thick, thin, warped, and heavy payload substrates to prevent breakage, edge damage, and scratches.
Heterogeneous integration drives new demands to solve wafer and substrate handling and shipping challenges. From thick and heavy payload to thin, warped, or contact-sensitive substrates, Entegris advanced packaging family of FOUPs, film frame shippers, and contactless horizontal shippers ensure safe, stable, and contamination-free handling with electrostatic discharge (ESD) protection.
Defect Prevention Solutions
Ensure safe transport of substrates of all materials, sizes, shapes, thickness, and planarity with FOUPs, film frame shippers, and carriers.
Evolving Substrate Handling Needs
Changing wafer shapes present a challenge for many fabs. Our substrate solutions provide for safe wafer transport whether they’re thin, thick, heavy payload, or warped.