Molybdenum, the Precursor Revolutionizing Semiconductor Manufacturing
In the rapidly evolving semiconductor industry, the demand for smaller dimensions and enhanced device performance is pushing the adoption of new metals in advanced logic and memory. As the industry evaluates lower-resistance and barrierless material alternatives, metals like molybdenum (Mo) are becoming the new standard for state-of-the-art device production.
Mo is being adopted in memory and logic applications due to its excellent electrical conductivity, compatibility with silicon and ease of integration into existing semiconductor processes, such as atomic layer deposition (ALD) and chemical mechanical planarization (CMP).
As a global leader with more than 20 years of experience in solid precursors and delivery, customers can rely on Entegris to help meet their ever-evolving needs in chip fabrication. From high-purity precursors and delivery vessels to advanced coatings and delivery cabinets, we have a full solution to enable the next-generation of advanced devices.
Migrating to Molybdenum
Learn how to speed the process of turning innovations into improved yield
Migrating to Molybdenum
Learn how to speed the process of turning innovations into improved yield
Migrating to Molybdenum
Learn how to speed the process of turning innovations into improved yield
White Paper
Migrating to Molybdenum: Comprehensive IC Solutions to Streamline the Transition
The need for smaller dimensions and increasing device performance requirements are driving the move to new metals for advanced logic and memory. The industry is evaluating lower-resistance and barrierless material alternatives. Molybdenum (Mo), ruthenium (Ru), or cobalt (Co) will soon become standard when producing state-of-the-art devices. The transition to Mo or another new metal will not be easy. IDMs need to accelerate speed-to-yield to run a high-purity process as quickly as possible. Choosing an experienced supplier that offers high-purity materials for multiple process steps helps avoid unnecessary challenges, obstacles, and risks. It smooths the path to high-volume production with higher yields.
Scaling New Heights: How Molybdenum is Revolutionizing 3D NAND Architectures
With AI and cloud infrastructure driving the demand for greater computing power and data storage, chipmakers have migrated from 2D to 3D NAND memory with 3D stacking becoming the primary way to achieve more storage in a smaller footprint. Learn why molybdenum (Mo) is a promising new alternative to tungsten (W) in advanced chip design, and how it has become a key material in overcoming the challenges of scaling 3D NAND architecture.