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Polishing Services
Our substrate polishing services range from reclaim wafers, finishing wafers, or polishing non-conventional samples. Our unique R&D capabilites allow us to develop custom polishing processes for wafers per customer requirements. We pride ourselves with developing several of the industry's most unique polishing processes.
Polishing Services Available
Diamond
Polishing and Reclaim of Diamond Substrates
Polishing Characteristics:
Excellent local and global surface finish (long range and short range roughness) 1 Å – 3 nm RMS roughness over 5x5 μm2 depending on the grain size (AFM), free of surface and subsurface damage
Applications:
MEMS & NEMS, Electronic device substrates, HEMTs, RF devices, MMICs, HFETs, Passive electronics – High thermal conductivity requirements
Wafer Specifications:
- Dimension: Any shape up to 100 mm diameter
- Thickness: 200 nm to 1 mm
- Type: Single Crystal, Microcrystalline, Nanocrystalline, Ultra-nano crystalline, Any doping
- Starting Surfaces: Mechanically polished or as-grown
Other Superhard Materials
Metals and Soft Materials (antimonides, phosphide, Low K, etc.)
- Silicon Carbide
- Gallium Nitride
- Diamond
- Sapphire
- Metal
- Dielectric
- Device Polish