Silicon Carbide Substrate Solutions
Silicon carbide (SiC) is rapidly becoming the substrate of choice for chipmakers in the EV and energy industries due to its wide bandgap structure and high temperature capacity. SiC chips enable fabrication of faster, more stable, and more efficient devices.
It is challenging to create defect-free SiC wafers during high-volume production. Mass manufacturing requires special considerations during wafer fabrication, chip preprocessing, device fabrication, and post processing. Entegris has created a full ecosystem of market-leading products and accompanying technologies to address SiC processing challenges. This includes:
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- Products and solutions for crystal growth such as specialty coated graphite and custom slurries for chemical mechanical planarization
- Pads and rings to support various industry polishing tools
- Device manufacturing solutions for epitaxy formation, etching and ion implantation, and removal of impurities through filtration and gas purification
- Unique products for wafer handling and transportation to reduce damage and contamination
The result is an ability to manufacture SiC substrates in higher volumes with the excellent surface quality and planarity required for device fabrication.
Learn more about our silicon carbide substrate solutions, then contact us to discuss your project!
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Mastering the SiC Wafer Transition
The use of silicon carbide (SiC) semiconductors offers a huge advantage for electric vehicles (EVs) due to lower switching losses and higher efficiencies, but cost has always been a drawback. SiC wafer manufacturing can suffer from high costs and lower yields, causing SiC semiconductors to cost up to eight times more than their silicon equivalents. This cost often gets passed on to the end customer, making EVs more expensive.
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Solving CMP Challenges in High-Volume SiC Production
The semiconductor manufacturing process creates defects in the SiC crystal that can degrade mobility. Lower electron mobility, in turn, leads to increased electrical resistance, reduced performance, and wasted power. CMP plays a key role in ensuring devices built with SiC substrates can be manufactured in high volumes. As the demand for SiC-based devices increases, optimizing the CMP process becomes crucial to ensure the desired surface quality and planarity required for device fabrication
Product Solutions
CMP Slurry Products
Minimize the impact of crystal growth defects and maximize high-quality wafer yield.
Thermoplastic polishing pads for silicon carbide (SiC) wafers offer the optimal balance of best-in-class performance, quality, and cost of ownership.
Best-in-class, bulk, point-of-tool, and point-of-dispense CMP slurry filter solutions to prevent micro-scratches and underlayer defects.
Precise control and measurement of process fluids for ultrapure applications in harsh environments.
High performance slurries for scalable manufacturing of atomically smooth and defect-free SiC wafers.
Learn more about our silicon carbide substrate solutions
Explore our full ecosystem of market-leading products and accompanying technologies to address SiC processing challenges
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